Lead Engineer, 3D Integration & Advanced Packaging

Lead Engineer, 3D Integration & Advanced Packaging

Entangled Future | Greater London, ENG, GB

Posted 7 days ago

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Description

Quantum Motion is a fast-growing quantum computing scale-up based in London founded by internationally renowned researchers from UCL and Oxford University with over 40 years’ experience in developing qubits and quantum computing architectures. Bringing together state-of-the-art cryogenic facilities and an outstanding interdisciplinary team, we are developing quantum processors based on industrial-grade silicon chips, with the potential to radically transform computing power in areas such as materials modelling, medicine, artificial intelligence and more.


Our Team


Since 2021 our team has been listed every year in the “Top 100 Startups worth watching” in the EE Times in 2021 and 2022, and our technology breakthroughs have been featured in The Telegraph, BBC and the New Statesman. Our founders are internationally renowned researchers from UCL and Oxford University who have pioneered the development of qubits and quantum computing architectures. Our chairman is the co-founder of Cadence and Synopsys, the two leading companies in the area of Electronic Design Automation. We’re backed by a team of top-tier investors, and we have recently closed our Series C funding of $160 million.


We bring together the brightest quantum engineers, integrated circuit (IC) engineers, quantum computing theoreticians and software engineers to create a unique, world-leading team, working together closely to maximise our combined expertise. Our collaborative and interdisciplinary culture is an ideal fit for anyone who thrives in a cutting-edge research and development environment focused on tackling big challenges and contributing to the development of scalable quantum computers based on silicon technology.


This is a rare and exciting opportunity to be an employee at a scale-up shaping the future of quantum computing. There are vast opportunities for professional growth and to make an impact within the company.


What they're looking for



  • Master’s or PhD in electrical engineering, materials science, physics, microelectronics, or related field.

  • 7+ years deep technical experience in 3D integration, specifically with TSVs, fine-pitch microbumps, flip-chip bonding, and/or multi-chip modules.

  • Proven track record or building, scaling, and managing engineering teams in high-tech, fast-paced environments.

  • Strong experience managing technical transfers and working closely with external semiconductor foundries or advanced packaging facilities.


Nice to have



  • Proficiency with industry-standard simulation tools (e.g., Ansys HFSS/Q3D, Cadence) to model signal integrity, thermal stress, and mechanical behaviour.

  • Direct experience with cryogenic electronics.

  • Background or strong familiarity with solid-state quantum mechanics, silicon spin qubits, or semiconductor physics.

  • Knowledge of materials behaviour (superconductors, low loss dielectrics) at extreme temperatures.


Pay and benefits



  • Be part of a creative, world-leading team

  • Competitive salary and share options scheme

  • Contributory pension scheme

  • Group private medical insurance scheme

  • Life Assurance

  • Cycle-to-work Scheme


Quantum Motion is a UK quantum computing company founded in 2017 out of Oxford and UCL, based in London. In September 2025 it delivered the UK's first full-stack silicon CMOS quantum computer to the National Quantum Computing Centre (NQCC).


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